the first high-temperature oxygen free annealing equipment (Furnace) independently developed by our
On December 23, 2024, the first high-temperature oxygen free annealing equipment (Furnace) independently developed by our company was officially moved into the customer's production line.
"Advanced packaging glass substrate - fully automatic bonding equipment" officially begins
On September 30, 2024, the second advanced packaging glass substrate (FOPLP) fully automatic bonding equipment (Panel Bonder) independently developed by our company was officially moved into the customer's production line.
The advanced packaging glass substrate (FOPLP)
On December 30, 2023, the advanced packaging glass substrate (FOPLP) fully automatic bonding equipment (Panel Bonder) independently developed by our company completed the customer's acceptance test and was officially put into use.
"first equipment" in China, was officially moved into the customer's production line
On October 16, 2023, the advanced packaging glass substrate (FOPLP) fully automatic bonding equipment (Panel Bonder) independently developed by our company, the "first equipment" in China, was officially moved into the customer's production line, realizing the transformation of advanced packaging technology from wafer level ( The product iteration of converting wafers to panel levels has effectively promoted the domestic substitution process in the semiconductor industry. This not only reduces the dependence of domestic enterprises on foreign technology, but also makes a positive contribution to the security and technological independence of the semiconductor industry.