Square plate bonding equipment
Wafer bonding equipment
Fully automatic high temperature oxygen-free oven
| Bonding chip size | 510mm*515mm/600mm*600mm |
| Temperature capability | normal temperature ~ 400℃ |
| Film loading method | semi-automatic/fully automatic |
| Bonding chip size | 510mm*515mm/600mm*600mm |
| Temperature capability | normal temperature ~ 400℃ |
| Film loading method | semi-automatic/fully automatic |